Hot-Plate BakeThermal Processing

Precise command of the temperature curve decides how resist and film finally behave.

The step

Process Overview

Bake steps drive resist cure, solvent evolution and film stress. We represent KE and TAZMO, providing sales and service for bake process equipment.

Partners

Official Japanese OEM channels, with sales and service under one roof.

Bake process equipment

Sales / service

Bake process equipment

Sales / service

Reference data

A snapshot of the main tool categories per brand; full specifications come with the quote.

Hot-Plate Bake equipment specifications (sample data; the formal quote governs)
Tool category	Applicable nodes	Key specifications
KEBake process equipment	All nodes	Temperature uniformity and profile control by tool configuration
TAZMOBake process equipment	All nodes	Temperature uniformity and profile control by tool configuration

※ Sample data, for evaluation only. Actual models, applicable nodes and specifications are confirmed in the formal quote.

Under the hood

Benchmark models published between 2024 and 2026, deployed together with the tool.

2.5D electro-thermal co-equivalent model with hybrid metaheuristics (PSO+SA)

Temperature MAE 0.35%, impedance 3.97%

Real-time mapping of bake temperature curves with deviation alerts

Thermal process drift caught early

End to end

One point of contact from purchase order to acceptance.

We provide new and used tool evaluation, specification confirmation and rigging quotes for Hot-Plate Bake equipment. Email us to get started.