02
Plasma EtchPattern Transfer
Nanoscale sculpting — cutting the circuit blueprint into the wafer.
The step
Process Overview
Etch decides the final profile and sidewall quality of every transferred pattern. We represent TEL and SAMCO etch equipment from Japan, with complete support from procurement through installation and maintenance.
Partners
Represented Brands
Official Japanese OEM channels, with sales and service under one roof.
TEL
Plasma etch systems
SAMCO
Etch and surface treatment systems
Reference data
Equipment Specifications
A snapshot of the main tool categories per brand; full specifications come with the quote.
| Tool category | Applicable nodes | Key specifications |
|---|---|---|
| TELPlasma etch systems | 28nm–3nm | Etch selectivity and uniformity by chamber configuration |
| SAMCOEtch and surface treatment systems | 28nm–3nm | Etch selectivity and uniformity by chamber configuration |
Under the hood
AI Integration
Benchmark models published between 2024 and 2026, deployed together with the tool.
TSMC Smart Manufacturing
RNN (time-series FDC) plus federated learning across chamber sensor streams
~92% yield-impact prediction (28–3nm), escape rate -15%
Digital Twin chamber simulation
Real-time virtual mirror of etch chamber state, supporting predictive maintenance
Less unplanned downtime
End to end
Service Flow
One point of contact from purchase order to acceptance.
- 1Procurement
- 2De-install
- 3Shipping
- 4Installation
- 5Acceptance
Request the tool list and a quote
We provide new and used tool evaluation, specification confirmation and rigging quotes for Plasma Etch equipment. Email us to get started.