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Wafer Inspection & TestMetrology

The segment where AI has gone deepest — the quality of every die made visible.

The step

Process Overview

Inspection and test is the most mature ground for AI, from wafer-map defect classification through adaptive test. We sell and service ADVANTEST and LASERTECHNIK equipment from Japan and integrate the most current AI models with it.

Partners

Represented Brands

Official Japanese OEM channels, with sales and service under one roof.

ADVANTEST

Wafer test systems

Sales / service

LASERTECHNIK

Optical inspection systems

Sales / service

Reference data

Equipment Specifications

A snapshot of the main tool categories per brand; full specifications come with the quote.

Wafer Inspection & Test equipment specifications (sample data; the formal quote governs)
Tool categoryApplicable nodesKey specifications
ADVANTESTWafer test systemsWafer-level test and advanced packagingChannel count and accuracy by tool configuration
LASERTECHNIKOptical inspection systemsWafer-level test and advanced packagingChannel count and accuracy by tool configuration
※ Sample data, for evaluation only. Actual models, applicable nodes and specifications are confirmed in the formal quote.

Under the hood

AI Integration

Benchmark models published between 2024 and 2026, deployed together with the tool.

G2LGAN + CNN

Two-stage GAN augmentation with MobileNetV2 wafer-map defect classification

Acc 98.39%, F1 93.01%

CNN-ESN

ResNet34 with an echo state network, robust on noisy wafer maps

Clean 94.74%, noisy 87.30%

IBM ASMC

Semi-supervised ViT (DINOv2) SEM defect classification, <15 images per class

>90% even with few samples

PDF Exensio

XGBoost + PCA yield prediction across defect, metrology, e-test and FDC data

Tunable threshold balances overkill and underkill

KGD / outlier detection

GPR spatial modeling with conformal prediction QR and CatBoost

Beats DPAT; ~90% Vmin coverage guarantee

InF-ATPG

FFR partitioning with QGNN and DQN

Backtracks -55.06%, UFP 0.50%

GPU real-time adaptive test

GPU-accelerated ML deployed in production

Blackwell volume production: -25% test time

Dual-path spatiotemporal model (DATE'25)

3D SW-MSA transformer for dynamic IR hotspot prediction

Outperforms 2D/3D CNNs and recurrent U-Net

End to end

Service Flow

One point of contact from purchase order to acceptance.

  1. 1Procurement
  2. 2De-install
  3. 3Shipping
  4. 4Installation
  5. 5Acceptance

Request the tool list and a quote

We provide new and used tool evaluation, specification confirmation and rigging quotes for Wafer Inspection & Test equipment. Email us to get started.